Liquid and solid state interfacial reactions of Sn–Ag–Cu and Sn–In–Ag–Cu solders with Ni–P under bump metallization-Reference-Cited by-同舟云学术

Liquid and solid state interfacial reactions of Sn–Ag–Cu and Sn–In–Ag–Cu solders with Ni–P under bump metallization

Published:2006-05 Issue:1-2 Volume:504 Page:431-435
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Sharif Ahmed,Chan Y.C.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. Tadatomo Suga, “Roadmap 2002 for Commercialization of Lead-free Solder” A report of Lead-Free Soldering Roadmap Committee, JEITA http://tsc.jeita.or.jp/tsc/comms/7_easm/english/leadfree/data/MAP-paper.doc.

2. Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

3. Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

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