Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: Effect of annealing temperature

Author:

Tang Wenbin,Long Xu,Yang Fuqian

Funder

National Natural Science Foundation of China

Natural Science Foundation of Shaanxi Province

Astronautics Supporting Technology Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment;The European Parliament;Off. J. Eur. Union,2003

2. A review: on the development of low melting temperature Pb-free solders;Kotadia;Microelectron. Reliab.,2014

3. Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity;Shohji;Mater. Sci. Eng. A,2004

4. Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain;Zhang;Mater. Sci. Eng. A,2017

5. Thermoelectric characteristics and tensile properties of Sn–9Zn– x Ag lead-free solders;Hung;J. Alloys Compd.,2006

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