Author:
Wang Ping-yang,Li Shuang-fei,Liu Zhen-hua
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference32 articles.
1. N.H. Khan, S.M. Alam, S. Hassoun. System-level comparison of power delivery design for 2D and 3D ICs, in: IEEE International Conference on 3D System Integration, 2009 3DIC, 2009, IEEE, 2009, pp. 1–7.
2. J. Frenkil, Tools and methodologies for low power design, in: Proceedings of the 34th annual Design Automation Conference, ACM, 1997, pp. 76–81.
3. H.-C. Chien, J.H. Lau, Y.-L. Chao, M.-J. Dai, R.-M. Tain, L. Li, et al., Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications, in: 2012 IEEE 62nd Electronic Components and Technology Conference, IEEE, 2012, pp. 1866–1873.
4. Next generation devices for electronic cooling with heat rejection to air;Webb;J. Heat Transf.,2005
5. K. Cheon, Deionized water cooling type cooling system for electronic device, Google Patents, 2002.
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