Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications-Reference-Cited by-同舟云学术

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Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications

Published:2012-05 Issue: Volume: Page:
ISSN:
Container-title:2012 IEEE 62nd Electronic Components and Technology Conference
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Author:

Chien Heng-Chieh,Lau John H.,Chao Yu-Lin,Dai Ming-Ji,Tain Ra-Min,Li L.,Su P.,Xue J.,Brillhart M.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6241679/6248788/06249092.pdf?arnumber=6249092

Cited by 27 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Modeling and Analysis of 3D ICS with Heat Dissipation Effect of Power Distribution Networks;Journal of Circuits, Systems and Computers;2024-07-20

2. Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging;Journal of Electronic Packaging;2023-06-23

3. Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-01

4. Multiple System and Heterogeneous Integration with TSV-Interposers;Chiplet Design and Heterogeneous Integration Packaging;2023

5. Electromagnetic Simulation and Realization of MCM GaAs MMICs Based Packaging for High Gain (40 dB) and High-Power (33dBm) Transmitter Applications;IETE Journal of Research;2022-08-11

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