Author:
Li Shuang-Fei,Bao Yi-Ying,Wang Ping-yang,Liu Zhen-hua
Funder
Shanghai Aerospace Science and Technology Innovation Fund
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference37 articles.
1. N.H. Khan, S.M. Alam, S. Hassoun, System-level comparison of power delivery design for 2D and 3D ICs, in: 2009 IEEE International Conference on 3D System Integration, 2009 3DIC. IEEE2009. pp. 1–7.
2. H.-C. Chien, J.H. Lau, Y.-L. Chao, M.-J. Dai, R.-M. Tain, L. Li, et al., Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications, in: 2012 IEEE 62nd Electronic Components and Technology Conference. IEEE 2012. pp. 1866–1873.
3. Next generation devices for electronic cooling with heat rejection to air;Webb;J. Heat Transf.,2005
4. K. Cheon, Deionized water cooling type cooling system for electronic device, Google Patents, 2002.
5. A review on thermoelectric cooling parameters and performance;Enescu;Renew. Sustain. Energy Rev.,2014
Cited by
22 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献