1. Saini, M., and Webb, R. L., 2002, “Heat Rejection Limits of Air Cooled Plane Fin Heat for Computer Cooling,” Proc. ITherm 2002, 8thIntersociety Conf. On Thermal and Thermomechanical Phenomena in Electronic Systems, May 30-Jun 1, San Diego, CA, pp. 1–8.
2. Saini, M., and Webb, R. L., 2002, “Validation of Models for Air Cooled Plane Fin Heat Sinks Used in Computer Cooling,” Proc. ITherm 2002, 8thIntersociety Conf. On Thermal and Thermomechanical Phenomena in Electronic Systems, May 30-Jun 1, San Diego, CA, pp. 243–250.
3. Webb, R. L., 1994. Principles of Enhanced Heat Transfer, John Wiley & Sons, New York.
4. Webb, R. L., and Yamauchi, S., 2002. "Remote Heat Sink Concept for High Power Heat Rejection," in THERMES 2002, Thermal Challenges in Next Generation Electronic Systems
5. eds. Y. Joshi and S. Garimella, Millpress, Rotterdam, pp. 201-210, 2002 (Also published in IEEE Trans. Components and Materials Packaging, Vol. 25, pp. 608-614, 2002).