Highly manufacturable 7nm FinFET technology featuring EUV lithography for low power and high performance applications

Author:

Ha Daewon,Yang C.,Lee J.,Lee S.,Lee S. H.,Seo K.-I.,Oh H. S.,Hwang E. C.,Do S. W.,Park S. C.,Sun M.-C.,Kim D. H.,Lee J. H.,Kang M. I.,Ha S.-S.,Choi D. Y.,Jun H.,Shin H. J.,Kim Y. J.,Lee J.,Moon C. W.,Cho Y. W.,Park S. H.,Son Y.,Park J. Y.,Lee B. C.,Kim C.,Oh Y. M.,Park J. S.,Kim S. S.,Kim M. C.,Hwang K. H.,Nam S. W.,Maeda S.,Kim D.-W.,Lee J.-H.,Liang M. S.,Jung E. S.

Publisher

IEEE

Cited by 59 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Fabrication Techniques for a Tuneable Room Temperature Hybrid Single-electron Transistor and Field-effect Transistor;Micro and Nano Engineering;2024-09

2. Gate Resistance Test Structures Bounded by Local Layout Density to Characterize Metal Gate Height Variation in 7nm FinFET Technology;2024 IEEE 33rd Microelectronics Design & Test Symposium (MDTS);2024-05-13

3. Cross-Coupled nFET Preamplifier for Low Voltage SRAM;IEEE Transactions on Circuits and Systems II: Express Briefs;2023-09

4. Surface hardening of extreme ultraviolet(EUV) photoresist by CS2 plasma for highly selective and low damage patterning;Applied Surface Science;2023-08

5. Principle, Structure, and Applications of Gallium Nitride High Electron Mobility Transistors (HEMTs);2023 19th International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery (ICNC-FSKD);2023-07-29

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