Stress and Reliability Challenges of Underfills in Large-Size Fan-Out Multichip Module Packages
Author:
Affiliation:
1. Siliconware Precision Industries Co., Ltd.,Department of Material Engineering,Tantzu,Taichung,Taiwan (R.O.C.),427
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9795348/9795361/09795431.pdf?arnumber=9795431
Reference5 articles.
1. Recent Advances in Underfill for New Package Architectures
2. Polysiloxane-Based Surface Modification of Silica Fillers for Low Stress Underfill
3. Effects of underfill thickness on mechanical properties and fracture behavior of Si/underfill/Si adhesion structures
4. Stress variation analysis during curing process of epoxy underfill
5. High Reliability Solution of 2.5D Package Technologies
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Underfill Selection Guideline for Fan-Out Heterogeneous Integration Package;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Stress and Reliability of Underfills in Heterogeneous Integration Fan-Out Multichip Module Packages;2023 International Conference on Electronics Packaging (ICEP);2023-04-19
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