Recent Advances in Underfill for New Package Architectures
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9043868/9059290/09059466.pdf?arnumber=9059466
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Underfill Selection Guideline for Fan-Out Heterogeneous Integration Package;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-10
3. Warpage behavior of the flip chip package in underfill curing process: in situ characterization and numerical simulation;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
4. Stress and Reliability of Underfills in Heterogeneous Integration Fan-Out Multichip Module Packages;2023 International Conference on Electronics Packaging (ICEP);2023-04-19
5. Effect of Underfill Additive Agents on Crack Prevention in Large Fan-Out Multichip Module Packages;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
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