Advanced Under-Bump-Metal Scaling Solder Micro-Bump Interconnect Down to 10μm Pitch-Reference-Cited by-同舟云学术

Advanced Under-Bump-Metal Scaling Solder Micro-Bump Interconnect Down to 10μm Pitch

Published:2022-05-11 Issue: Volume: Page:
ISSN:
Container-title:2022 International Conference on Electronics Packaging (ICEP)
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Author:

Tanaka Takahiro¹,Hatabe Masaru¹,Yamada Hironori¹,Li Zhaozhi²,Tomita Yoshihiro²

Affiliation:

1. Ishihara Chemical Corporation,Research and Development Department,Kobe,Hyogo,Japan

2. Assembly & Test Technology Development, Intel Corporation,Chandler,AZ,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9795348/9795361/09795439.pdf?arnumber=9795439

Reference2 articles.

1. Scaling Solder Micro-Bump Interconnect Down to 10?m Pitch for Advanced 3D IC Packages;li;IEEE 71st Electronic Components and Technology Conference,2021

2. Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect

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