Nanocrystalline copper films are never flat-Reference-Cited by-同舟云学术

Nanocrystalline copper films are never flat

Published:2017-07-28 Issue:6349 Volume:357 Page:397-400
ISSN:0036-8075
Container-title:Science
language:en
Short-container-title:Science

Author:

Zhang Xiaopu¹^ORCID,Han Jian²,Plombon John J.³^ORCID,Sutton Adrian P.⁴^ORCID,Srolovitz David J.²⁵^ORCID,Boland John J.¹^ORCID

Affiliation:

1. School of Chemistry, Centre for Research on Adaptive Nanostructures and Nanodevices (CRANN) and Advanced Materials and Bioengineering Research (AMBER), Trinity College Dublin, Dublin 2, Ireland.

2. Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, PA 19104, USA.

3. Components Research, Intel Corporation, Hillsboro, OR 97124, USA.

4. Department of Physics, Imperial College London, Exhibition Road, London SW7 2AZ, UK.

5. Department of Mechanical Engineering and Applied Mechanics, University of Pennsylvania, Philadelphia, PA 19104, USA.

Abstract

Flat-out failure of copper films As integrated circuits shrink in size, so does their nanocrystalline metal wiring. Defects at the interfaces between crystallites (grain boundaries) can degrade wires' electrical and thermal conductivity, as well as their longevity. Using scanning tunneling microscopy, Zhang et al. showed that the surfaces of nanocrystalline copper films are not flat but rather have ridges and valleys created by the grains rotating out of plane, which then introduces grain boundary defects. Such defects might be avoided if films of different orientations could be grown. Science , this issue p. 397

Funder

National Science Foundation

Science Foundation Ireland

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

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