Capacitive Electron Cooling in an Inductively Coupled Plasma Source/Capacitively Coupled Plasma Bias Reactor
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Reference30 articles.
1. Process characterization for tapered contact etch
2. A spacer patterning technology for nanoscale CMOS
3. Etch-induced damage in single crystal Si trench etching by planar inductively coupled Cl2/N2 and Cl2/HBr plasmas
4. Plasma Charging Damage
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Investigation of the dual-frequency bias effect on inductively coupled Cl2 plasmas by hybrid simulation;Journal of Physics D: Applied Physics;2023-06-08
2. Investigation of stochastic heating and its influence on plasma radial uniformity in biased inductively coupled Ar discharges by hybrid simulation;Physics of Plasmas;2023-04-01
3. Hybrid simulation of radio frequency biased inductively coupled Cl2 plasmas;Physics of Plasmas;2021-05
4. Effect of the RF bias on the plasma density in an argon inductively coupled plasma;Physics of Plasmas;2020-09
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