Impact of thinning the GaN buffer and interface layer on thermal and electrical performance in GaN-on-diamond electronic devices-Reference-Cited by-同舟云学术

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Impact of thinning the GaN buffer and interface layer on thermal and electrical performance in GaN-on-diamond electronic devices

Published:2019-01-31 Issue:2 Volume:12 Page:024003
ISSN:1882-0778
Container-title:Applied Physics Express
language:
Short-container-title:Appl. Phys. Express

Author:

Middleton Callum,Chandrasekar Hareesh,Singh Manikant,Pomeroy James W.,Uren Michael J.,Francis Daniel,Kuball Martin

Funder

Engineering and Physical Sciences Research Council

Publisher

IOP Publishing

Subject

General Physics and Astronomy,General Engineering

Link

https://iopscience.iop.org/article/10.7567/1882-0786/aaf4ee/pdf

Reference19 articles.

1. Gallium nitride devices for power electronic applications

2. A Review of Raman Thermography for Electronic and Opto-Electronic Device Measurement With Submicron Spatial and Nanosecond Temporal Resolution

3. Characterization of AlGaN/GaN HEMTs Using Gate Resistance Thermometry

4. Low thermal resistance GaN-on-diamond transistors characterized by three-dimensional Raman thermography mapping

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Synthesis of nano-diamond film on GaN surface with low thermal boundary resistance and high thermal conductivity;Carbon;2024-10

2. Understanding of multiway heat extraction using peripheral diamond in an AlGaN/GaN high electron mobility transistor by electrothermal simulations;Semiconductor Science and Technology;2024-06-07

3. Interfacial thermal conductance of gallium nitride/graphene/diamond heterostructure based on molecular dynamics simulation;Acta Physica Sinica;2024

4. Development of Diamond Device-Level Heat Spreader for the Advancement of GaN HEMT Power and RF Electronics;IEEE Transactions on Device and Materials Reliability;2023-12

5. Modeling and analyzing near-junction thermal transport in high-heat-flux GaN devices heterogeneously integrated with diamond;International Communications in Heat and Mass Transfer;2023-04

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