Three-dimensional interconnect layers inkjet printed on plastic substrates using continuous-wave xenon light sintering
Author:
Funder
Japan Society for the Promotion of Science
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/58/i=1/a=016507/pdf
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1. Horizontal and vertical integration of product data for the design of moulded interconnect devices
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3. Three-dimensional automatic routing for the design of moulded interconnect devices
4. Direct-print/cure as a molded interconnect device (MID) process for fabrication of automobile cruise controllers
5. Flexible free-standing SU-8 microfluidic impedance spectroscopy sensor for 3-D molded interconnect devices application
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