Horizontal and vertical integration of product data for the design of moulded interconnect devices-Reference-Cited by-同舟云学术

Horizontal and vertical integration of product data for the design of moulded interconnect devices

Published:2009-11 Issue:11 Volume:22 Page:1024-1036
ISSN:0951-192X
Container-title:International Journal of Computer Integrated Manufacturing
language:en
Short-container-title:International Journal of Computer Integrated Manufacturing

Author:

Zhuo Y.,Alvarez C.,Feldmann K.

Publisher

Informa UK Limited

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanical Engineering,Aerospace Engineering

Link

http://www.tandfonline.com/doi/pdf/10.1080/09511920902741091

Reference19 articles.

1. Internet-Based Collaborative Design for an Injection-moulding System

2. Multiple-view feature modelling for integral product development

3. Feature-based CAD-CAE integration model for injection-moulded product design

4. Feldmann, K. Introduction: MID – entering markets by products and technologies. Proceedings of the 3rd International Congress on Molded Interconnect Devices. Erlangen, Germany. pp.5–17.

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