Direct-print/cure as a molded interconnect device (MID) process for fabrication of automobile cruise controllers-Reference-Cited by-同舟云学术

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Direct-print/cure as a molded interconnect device (MID) process for fabrication of automobile cruise controllers

Published:2015-12 Issue:12 Volume:29 Page:5377-5385
ISSN:1738-494X
Container-title:Journal of Mechanical Science and Technology
language:en
Short-container-title:J Mech Sci Technol

Author:

Lu Yanfeng,Yun Hae-Yong,Vatani Morteza,Kim Ho-Chan,Choi Jae-Won

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials

Link

http://link.springer.com/content/pdf/10.1007/s12206-015-1139-1.pdf

Reference39 articles.

1. M. S. Kim, W. S. Chu, Y. M. Kim, A. P. G. Avila and S. H. Ahn, Direct metal printing of 3D electrical circuit using rapid prototyping, International J. of Precision Engineering and Manufacturing, 10 (5) (2009) 147–150.

2. H. Jung, Y. Kim, S. Kim, J. Jang and J. W. Hahn, Sub-micro to nanometer scale laser direct writing techniques with a contact probe, International J. of Precision Engineering and Manufacturing, 12 (5) (2011) 877–883.

3. M. I. S. Ismail, Y. Okamoto, A. Okada, Y. Uno and K. Ueoka, Direct micro-joining of flexible printed circuit and metal electrode by pulsed Nd: YAG laser, International J. of Precision Engineering and Manufacturing, 13 (3) (2012) 321–329.

4. C. M. B. Ho, S. H. Ng and Y. J. Yoon, A review on 3D printed bioimplants, International J. of Precision Engineering and Manufacturing, 16 (5) (2015) 1035–1046.

5. L. L. Lebel, B. Aissa, A. E. Khakani and D. Therriault, Ultraviolet-assisted direct-write fabrication of carbon nanotube/polymer nanocomposite microcoils, Advanced Material, 22 (5) (2010) 592–596.

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3. Characterization of the anisotropic conductive behavior of a copper paste for structural electronics;Journal of Science: Advanced Materials and Devices;2022-06

4. A Survey of 3D Printing Technologies as Applied to Printed Electronics;IEEE Access;2022

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