Affiliation:
1. a Department of Mechanical and Electrical Engineering , Xiamen University , Xiamen, China
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanical Engineering,Aerospace Engineering
Reference22 articles.
1. 3-D MID e.V. Technologie 3D-MID – Räumliche elektronische Baugruppen – Herstellungsverfahren, Gebrauchsanforderungen. Materialkennwerte, Carl Hanser Verlag.
2. State space representation of manufacturing operation plans in the presence of flexible routing capability
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