A novel procedure for failure criteria determination at solder joints under the board level drop test

Abstract

Abstract Controlling and monitoring of dynamic responses are very important to ensure consistent test results and understand mechanical behaviors, as they are closely related to the solder joint failure mechanism. The failure of a solder joint during drop impact is induced by printed circuit board (PCB) bending. The failure criteria must be clear to determine the absolute impact life for direct comparison of drop test results. In this publication, a multi-channel real time electrical monitoring system is introduced, which can measure the dynamic voltage of daisy-chained solder joints in real-time during drop impact. A new failure criteria of board level drop test is developed, which takes the function of the component into account.