Measurement of Trapping Behavior of Dust Particles During Plasma Process by Suck-Out Method
Author:
Affiliation:
1. Environmental Engineering Department, Rion Co. Ltd.
2. Department of Chemical Engineering, Graduate School of Engineering, Hiroshima University
Publisher
Society of Chemical Engineers, Japan
Subject
General Chemical Engineering,General Chemistry
Link
http://www.jstage.jst.go.jp/article/kakoronbunshu/29/4/29_4_513/_pdf
Reference18 articles.
1. Transport of dust particles in glow-discharge plasmas
2. Electrostatic trapping of contamination particles in a process plasma environment
3. Particle agglomeration study in rf silane plasmas:Insitustudy by polarization‐sensitive laser light scattering
4. Particle generation and thin film surface morphology in the tetraethylorthosilicate/oxygen plasma enhanced chemical vapor deposition process
5. Novelin situmethod to detect subnanometer‐sized particles in plasmas and its application to particles in helium‐diluted silane radio frequency plasmas
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3. Incorporation of Dust Particles into a Growing Film During Silicon Dioxide Deposition from a TEOS/O2Plasma;Aerosol Science and Technology;2005-05
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