Temperature-dependent stability of stacking faults in Al, Cu and Ni: first-principles analysis
Author:
Publisher
IOP Publishing
Subject
Condensed Matter Physics,General Materials Science
Link
http://stacks.iop.org/0953-8984/26/i=38/a=385402/pdf
Reference42 articles.
1. Generalized-stacking-fault energy surface and dislocation properties of aluminum
2. The influence of stacking fault energy on high temperature creep behaviour laws: The case of Cu and Cu-4Si
3. The influence of stacking fault energy on creep
4. The physics of high temperature creep in metals
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3. Dynamics of edge dislocation in Cu–Ni solid solution alloys at atomic scale;International Journal of Plasticity;2020-12
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