Multiscale microstructure containing nanometer-scale precipitations and stacking faults yields a high-strength Al-5Cu alloy by electron beam freeform fabrication
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Published:2024-03
Issue:
Volume:266
Page:119682
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ISSN:1359-6454
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Container-title:Acta Materialia
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language:en
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Short-container-title:Acta Materialia
Author:
Cui Ran,
Wang Liang,
Su Yanqing,
Li Binqiang,
Yao Longhui,
Wang BinbinORCID,
Luo Liangshun,
Chen Ruirun,
Guo Jingjie,
Tan XipengORCID
Cited by
5 articles.
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