The influence of stacking fault energy on high temperature creep behaviour laws: The case of Cu and Cu-4Si-Reference-Cited by-同舟云学术

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The influence of stacking fault energy on high temperature creep behaviour laws: The case of Cu and Cu-4Si

Published:2009-11 Issue:3 Volume:2 Page:1281-1284
ISSN:1875-3892
Container-title:Physics Procedia
language:en
Short-container-title:Physics Procedia

Author:

Retima M.,Chadli H.

Publisher

Elsevier BV

Subject

General Engineering

Reference14 articles.

1. On grain boundary sliding and diffusional creep

2. The transition from dislocation climb to viscous glide in creep of solid solution alloys

3. On the symmetrical role of cross-slip of screw dislocations and climb of edge dislocations as recovery processes controlling high-temperature creep

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Temperature-dependent stability of stacking faults in Al, Cu and Ni: first-principles analysis;Journal of Physics: Condensed Matter;2014-09-04

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