A wafer mapping technique for residual stress in surface micromachined films-Reference-Cited by-同舟云学术

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A wafer mapping technique for residual stress in surface micromachined films

Published:2016-07-20 Issue:9 Volume:26 Page:095013
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Schiavone G,Murray J,Smith S,Desmulliez M P Y,Mount A R,Walton A J

Funder

Engineering and Physical Sciences Research Council

Innovative electronics Manufacturing Research Centre

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://stacks.iop.org/0960-1317/26/i=9/a=095013/pdf

Reference43 articles.

1. Conquering Process Variability: A Key Enabler for Profitable Manufacturing in Advanced Technology Nodes

2. Dependence of Process Parameters on Stress Generation in Aluminum Thin Films

3. Electroplating of low stress permalloy for MEMS

4. On the Stoney Formula for a Thin Film/Substrate System With Nonuniform Substrate Thickness

5. Effects of Process Conditions on Properties of Electroplated Ni Thin Films for Microsystem Applications

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1. The impact of mechanical post-treatment on the tribological and corrosion behavior of CrN/CrAlN coatings applied using the CAE-PVD technique;Applied Surface Science Advances;2023-12

2. Accurate Identification of the Evolution of MEMS Resonant Accelerometer Residual Stresses at the Wafer-Die-Chip Level;Journal of Microelectromechanical Systems;2022-08

3. Complete stress release in monolayer ALD-Al₂O₃ films based on mechanical equilibrium homeostasis to realize a bending radius of 1 mm;Soft Matter;2022

4. Thin films residual stress profile evaluation using test microstructures: Illustrated on an example of AlN film;Journal of Vacuum Science & Technology B;2021-05

5. A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer;Micromachines;2021-03-26

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