A novel capillary-effect-based solder pump structure and its potential application for through-wafer interconnection
Author:
Publisher
IOP Publishing
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
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1. Ultra-Low Resistance, Through-Wafer Via (TWV) Technology and Its Applications in Three Dimensional Structures on Silicon
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1. Through‐substrate Vias;3D and Circuit Integration of MEMS;2021-04-23
2. Study of a through-silicon/substrate via filling method based on the combinative effect of capillary action and liquid bridge rupture;Journal of Micromechanics and Microengineering;2016-06-10
3. 3-D Integration and Through-Silicon Vias in MEMS and Microsensors;Journal of Microelectromechanical Systems;2015-10
4. Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires;Journal of Micromechanics and Microengineering;2012-08-17
5. Wire-bonded through-silicon vias with low capacitive substrate coupling;Journal of Micromechanics and Microengineering;2011-07-26
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