1. Hirama I. (2015).New MEMS sensor process by TSV technology for smaller packaging IEEE International Conference on Electronics Packaging iMAPS All Asia Conference 456–459.
2. Revolution of sensors in micro‐electromechanical systems;Esashi M.;Jpn. J. Appl. Phys.,2012
3. Goldberg H.D Breuer K.S. Schmidt M.A.. et al. (1994).A silicon‐wafer bonding technology for microfabricated shear‐stress sensor with backside contacts. Technical Digest Solid‐State Sensor and Actuator Workshop 111–115.
4. Vacuum packaging for microsensors by glass‐silicon anodic bonding;Henmi H.;Sens. Actuat. A,1994
5. Linder S Baltes H. Gnaedinger F.. et al. (1994).Fabrication technology for wafer through‐hole interconnections and three‐dimensional stacks of chips and wafers. IEEE Micro Electro Mechanical Systems Conference 349–354.