Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires-Reference-Cited by-同舟云学术

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Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires

Published:2012-08-17 Issue:10 Volume:22 Page:105001
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Fischer A C,Bleiker S J,Haraldsson T,Roxhed N,Stemme G,Niklaus F

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference43 articles.

1. Through-Silicon Via (TSV)

2. High-Density Through Silicon Vias for 3-D LSIs

3. Two-Dimensional and Three-Dimensional Integration of Heterogeneous Electronic Systems Under Cost, Performance, and Technological Constraints

4. Handbook of 3D Integration

5. 3D LED and IC wafer level packaging

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