Design consideration and fabrication of 1.2-kV 4H-SiC trenched-and-implanted vertical junction field-effect transistors
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy
Link
https://iopscience.iop.org/article/10.1088/1674-1056/23/7/077201/pdf
Reference14 articles.
1. SiC power-switching devices-the second electronics revolution?
2. High-temperature electronics - a role for wide bandgap semiconductors?
3. High-performance 4H-SiC junction barrier Schottky diodes with double resistive termination extensions
4. The fabrication and characterization of 4H—SiC power UMOSFETs
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3. Investigations on mesa width design for 4H–SiC trench super junction Schottky diodes;Chinese Physics B;2018-08
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