Intermetallic compound formation and solderability for immersion tin-Reference-Cited by-同舟云学术

Intermetallic compound formation and solderability for immersion tin

Published:2006-12 Issue:4 Volume:32 Page:3-8
ISSN:0305-6120
Container-title:Circuit World
language:en
Short-container-title:Circuit World

Author:

Chan C.M.,Tong K.H.,Kwok R.W.M.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Reference5 articles.

1. Lamprecht, S., Schreier, H.J. and Vogel, R. (2002), “Ageing characteristics of immersion tin surface finishes”, Proceedings of SMTA International, Chicago, IL, USA, September 2002.

2. Immersion tin as a high performance solderable finish for fine pitch PWBs

3. Open repair technologies for MCM-D

4. Physics and materials challenges for lead-free solders

5. Intermetallic growth on PWBs soldered with Sn3.8Ag0.7Cu

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