Intermetallic growth on PWBs soldered with Sn3.8Ag0.7Cu
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/7890/21740/01008263.pdf?arnumber=1008263
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5. Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold;The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects;2011
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