1. Amagai, M. and Yajima, K. (1998), “High solder joint reliability; μBGA packages with polymer die attach films”,Proceedings of the SPIE the International Society for Optical Engineering, San Diego, CA, International Symposium on Microelectronics, 1‐4 November 1998, pp. 525‐30.
2. Darveaux, R. (2000), “Effect of simulation methodology on solder joint crack growth correlation”,Proceedings of the 50th IEEE Electronic Components and Technology Conference, Las Vegas, CA, pp. 1048‐58.
3. Darveaux, R. and Mawer, A. (1995), “Thermal and power cycling limits of plastic ball grid array (PBGA) assemblies”,Proceedings of the 5th Surface Mount International Conference, San Jose, CA, pp. 315‐26.
4. Jones, K.W., Liu, Y., Zampino, M. and Gonzales, G. (1997), “The mechanical properties of lead‐tin based solders in the temperature range from −200°C to 150°C”,The International Journal of Microcircuits and Electronic Packaging, Vol. 20 No. 2, pp. 150‐4.
5. Nousiainen, O., Rautioaho, R., Leppävuori, S., Uusimäki, A. and Tian, D. (2001), “Acoustic micro imaging of fatigue cracking in solder joints of LTCC modules”,Proceedings of the 13th IMAPS European Microelectronics and Packaging Conference, Strasbourg, 30 May‐1 June, pp. 172‐7.