A prognostic method for the embedded failure monitoring of solder interconnections with 1149.4 test bus architecture-Reference-Cited by-同舟云学术

A prognostic method for the embedded failure monitoring of solder interconnections with 1149.4 test bus architecture

Published:2009-07 Issue:7 Volume:40 Page:1069-1080
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Voutilainen Juha,Putaala Jussi,Moilanen Markku,Jantunen Heli

Publisher

Elsevier BV

Subject

General Engineering

Reference14 articles.

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2. Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies;Kangasvieri;Microelectron. Reliab.,2006

3. Effects of Solder Joint Shape and Height on Thermal Fatigue Lifetime;Liu;IEEE T. Compon. Pack T.,2003

4. Standard for a Mixed Signal Test Bus,2000

5. N. Okinaga, H. Kuroda, Y. Nagai, Excellent reliability of solder ball made of a compliant plastic core, in: Proceedings of the 51st electronic components and technology conference (ECTC), 2001, pp. 1345–1349.

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Current State of the Mixed-Signal Test Bus 1149.4;Journal of Electronic Testing;2012-11-17

2. Influence of Thermal-Cycling-Induced Failures on the RF Performance of Ceramic Antenna Assemblies;IEEE Transactions on Components, Packaging and Manufacturing Technology;2011-09

3. Solder interconnection failure time estimation based on the embedded precursor behaviour modelling;Microelectronics Reliability;2011-02