Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes

Author:

Illés Balázs,Krammer Olivér,Géczy Attila,Garami Tamás

Abstract

Purpose – The purpose of this paper is to present a novel and alternative method for the characterization of isotropic conductive adhesive (ICA) joints’ conductivity by the calculation of the mean intercept length of conductive flakes in the cured joint. ICAs are widely used in the field of hybrid electronics or special printed circuit board applications, such as temperature sensitive or flexible circuits. The main quality parameters of the ICA joints are the conductivity and the mechanical strength. Design/methodology/approach – For the experiments, one-component Ag-filled thermoset ICA paste was used on FR4 printed circuit test board to join zero-ohm resistors. Six different curing temperatures were applied: 120, 150, 175, 210, 230 and 250°C. The conductivity of the joints was measured in situ during the curing process. Micrographs were taken from the cross-sectioned joints, and the mean intercept length was calculated on them after image processing steps. Findings – Results of the measured conductivity and the mean intercept length were compared, and acceptable correlation was found for what can be used for characterizing the conductibility of ICA joints. Research limitations/implications – Investigating and characterizing the conductivity of ICA joints by an image processing method. Originality/value – The main advantage of this method compared to the electrical measurements is that the conductivity characterization is possible on any kind of component. Therefore, this method can be used in any appliances not only in test circuits.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Additive Manufacturing of Electronics from Silver Nanopowders Sintered on 3D Printed Low‐Temperature Substrates.;Advanced Engineering Materials;2021-01-25

2. Electrically Conductive Paste Printed Volume Influence on Bonds Properties;2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME);2019-10

3. Whisker growth from vacuum evaporated submicron Sn thin films;Surface and Coatings Technology;2017-02

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