Using nano hexagonal boron nitride particles and nano cubic silicon carbide particles to improve the thermal conductivity of electrically conductive adhesives-Reference-Cited by-同舟云学术

Using nano hexagonal boron nitride particles and nano cubic silicon carbide particles to improve the thermal conductivity of electrically conductive adhesives

Published:2013-01 Issue:1 Volume:9 Page:1-5
ISSN:1738-8090
Container-title:Electronic Materials Letters
language:en
Short-container-title:Electron. Mater. Lett.

Author:

Cui Hui-wang,Li Dong-sheng,Fan Qiong

Publisher

Springer Science and Business Media LLC

Subject

Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s13391-012-2114-y.pdf

Reference16 articles.

1. Y. Li and C. P. Wong, Mater. Sci. Eng. R51, 1 (2006).

2. I. Mir and D. Kumar, Int. J. Adhes. Adhes. 28, 362 (2008).

3. W.-H. Du, C.-E. Fu, S. Chen, H.-W. Cui, X.-H. Liu, T.-A. Chen, and J. Liu, Proc. 2010 11th Int. Conf. Electron. Pack. Technol. High Density Pack, p. 199, Xi’an, China (2010).

4. H.-X. Lai, X.-Z. Lu, H.-W. Cui, X.-H. Liu, S. Chen, T.-A. Chen, and J. Liu, Proc. 2010 11th Int. Conf. Electron. Pack. Technol. High Density Pack, p. 235, Xi’an, China (2010).

5. W.-K. Tao, S. Chen, X.-H. Liu, H.-W. Cui, T.-A. Chen, and J. Liu, Proc. 2010 11th Int. Conf. Electron. Pack. Technol. High Density Pack, p. 225, Xi’an, China (2010).

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