TMA, DMA, DSC and TGA of lead free solders-Reference-Cited by-同舟云学术

TMA, DMA, DSC and TGA of lead free solders

Published:1999-08-01 Issue:2 Volume:11 Page:17-24
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:

Author:

Lau John H.,Chang Chris

Abstract

Most of the electronics packaging materials, especially solders, are temperature dependent. Their temperature‐dependent material properties can be obtained by TMA (thermal mechanical analysis), DMA (dynamic mechanical analysis), DSC (differential scanning calorimetry), and TGA (thermogravimetric analysis). In this study, the thermal coefficient of expansion (TCE), storage modulus, moisture uptake, and melting point of two lead free solders, 96.5wt%Sn‐3.5wt%Ag and 42wt%Sn‐58wt%Bi provided from two different vendors, are measured by, respectively, TMA, DMA, TGA, and DSC. For comparison purpose, the 63wt%Sn‐37wt%Pb solder is also considered.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference35 articles.

1. 1. Lau, J. H. and Lee, W‐S.R., Chip Scale Package: Design, Materials, Process, Reliability, and Applications, McGraw‐Hill, New York, NY, 1999.

2. 2. Lau, J. H., Wong, C.P., Prince, J.L. and Nakayama, W., Electronics Packaging: Design, Materials, Process, and Reliability, McGraw‐Hill, New York, NY, 1998.

3. 3. Lau, J.H. and Pao, Y.‐H., Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw‐Hill, New York, NY, 1997.

4. 4. Lau, J.H., Flip Chip Technologies, McGraw‐Hill, New York, NY, 1996.

5. 5. Lau, J.H., Ball Grid Technology, McGraw‐Hill, New York, NY, 1995.

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