Author:
Gancarz Tomasz,Fima Przemysław,Pstruś Janusz
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference25 articles.
1. C. Schmetterer, A. Mikula, and H. Ipser, Database for Properties of Lead-Free Solder Alloys, 2006, www.syncpower.com/datasheet/db_pbfree_solder.pdf . Accessed 20 August, 2013
2. K. Suganuma and K.S. Kim, Sn-Zn Low Temperature Solder, J. Mater. Sci.: Mater. Electron., 2007, 18, p 121–127
3. L. Zhang, S. Xue, L. Gao, Z. Sheng, and H. Ye, Development of Sn-Zn Lead-Free Solders Bearing Alloying Elements, J. Mater. Sci.: Mater. Electron., 2010, 21, p 1–15
4. M. McCormack, S. Jin, and H.S. Chen, New Lead-Free Sn-Zn-In Solder Alloys, J. Electron. Mater., 1994, 23, p 687–690
5. P. Fima, T. Gancarz, J. Pstrus, and A. Sypien, Wetting of Sn-Zn-xIn (x = 0.5, 1.0, 1.5 wt%) Alloys on Cu and Ni Substrates, J. Mater. Eng. Perform., 2012, 21, p 595–598
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