Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry-Reference-Cited by-同舟云学术

Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry

Published:2008-11-06 Issue:2 Volume:38 Page:227-230
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Wu Y.K.,Lin K.L.,Salam B.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-008-0589-y.pdf

Reference9 articles.

1. L. Kehoe and G.M. Crean, Proceedings of the 4th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, GA, USA, 1998, p. 203.

2. J.R. Lloyd, C. Zhang, H.L. Tan, D. Shangguan, and A. Achari, Proceedings of the IEEE/CPMT IEMT Symposium, Austin, TX, USA, 1995, p. 252.

3. Lau, J.H. and Chang, C., Solder Surf Mt Tech, 11, 7 (1999).

4. ASTM International, ASTM E1269-05 (2007).

5. D.R. Gaskell, Introduction to the Thermodynamics of Materials, 3rd ed. (Washington, DC: Taylor and Francis, 1995), p. 545.

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