Reliability studies of InnoLot and SnBi joints soldered on DBC substrate

Abstract

Purpose This paper aims to investigate the quality and reliability of solder joints prepared from Pb-free alloys on direct bounded Cu (DBC) substrates. Two types of solder alloys were studied: Sn90.95Ag3.8Cu0.7Sb1.4Ni0.15Bi3.0, with a high melting point of 225°C, and Sn42Bi58, with low a melting point of 138°C. Design/methodology/approach Capacitor components of size 1806 were soldered on DBC substrates by using convection reflow soldering and vacuum vapor-phase soldering technologies. A part of the samples was subjected to the thermal shock test. The structure of the solder joints and the content of the voids were investigated using three-dimensional X-ray tomography. The mechanical strength of the joints was evaluated using the shear force test, and the microstructure of the joints was studied on metallographic cross sections by using scanning electron microscopy. Findings It was found that the number of voids is not related directly to the mechanical strength of the solder joints. The mechanical strength of the solder joints depends more on the amount of Ag3Sn precipitation, Au precipitation and the intermetallic layer in the solder joints. In some cases, the thermal shock test caused micro-cracks around the Au precipitation because of a mismatch of Au, AuSn4 and Sn in terms of coefficients of thermal expansion. Originality/value DBC substrates are usually used for power electronics, where the quality of the solder joints is even more important than in the case of commercial electronics.