Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering-Reference-Cited by-同舟云学术

Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering

Published:2017-06 Issue: Volume:109 Page:167-174
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Géczy Attila

Funder

Hungarian Academy of Sciences

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference38 articles.

1. Today’s vapor phase soldering - an optimized reflow technology for lead free soldering;Leicht,2008

2. VPS Solution for Lead-Free Soldering in EMS Industries;Plotog,2008

3. A. Thumm, Going lead free with vapor phase soldering - lead free is still a challenge for major industries, in: Proc. of SMTA Int. Conf. on Soldering and Reliability, 2010.i.

4. Voids investigation in solder joints performed with vapour phase soldering (VPS);Synkiewicz;Solder. Surf. Mount Technol.,2014

5. Application of Vapor Phase Soldering (VPS) for joints reliability improvement;Skwarek;Int. J. Model. Optim.,2013

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