Latent heat induced deformation of PCB substrate: Measurement and simulation-Reference-Cited by-同舟云学术

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Latent heat induced deformation of PCB substrate: Measurement and simulation

Published:2022-08 Issue: Volume:36 Page:102173
ISSN:2214-157X
Container-title:Case Studies in Thermal Engineering
language:en
Short-container-title:Case Studies in Thermal Engineering

Author:

Froš Denis,Veselý Petr,Zemen Jan,Dušek Karel

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Engineering (miscellaneous)

Reference30 articles.

1. Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: a comparative study;Tsai;Appl. Soft Comput.,2012

2. Influence of manufacturing mechanical and thermal histories on dimensional stabilities of FR4 laminate and FR4/Cu-plated holes;Rudajevová;Materials,2018

3. Effect of lead-free soldering on key material properties of FR-4 printed circuit board laminates;Sanapala;IEEE Trans. Electron. Packag. Manuf.,2009

4. Residual strain in PCBs with Cu-plated holes;Rudajevova;J. Electron. Mater.,2017

5. Reliability testing for microvias in printed wire boards;Birch;Circ. World,2009

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Monitoring the homogeneity of temperature fields in thermal chambers;2024 9th International Conference on Energy Efficiency and Agricultural Engineering (EE&AE);2024-06-27

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