Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study

Author:

Tsai Tsung-Nan

Publisher

Elsevier BV

Subject

Software

Reference42 articles.

1. Optimizing the reflow profile via defect mechanism analysis;Lee;Soldering & Surface Mount Technology,1999

2. Optimization of reflow-thermal profile by design of experiments with response surface methodology for minimizing solder-ball defects;Chuvej,2008

3. Forecasting and parameters optimization of reflow soldering profile based on BPNN and GA;Zhang;Advanced Materials Research,2010

4. One solder profile for all board?;Prasad;Surface Mount Technology Magazine,2000

5. Distribution of the heat transfer coefficient in convection reflow oven;Illés;Applied Thermal Engineering,2010

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