Investigations of assembly properties of conductive layers in LTCC circuits-Reference-Cited by-同舟云学术

Investigations of assembly properties of conductive layers in LTCC circuits

Published:2001-08 Issue:2 Volume:18 Page:11-15
ISSN:1356-5362
Container-title:Microelectronics International
language:en
Short-container-title:Microelectronics International

Author:

Bochenek A.,Bober B.,Dziedzic A.,Golonka L.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference3 articles.

1. Bober, B. Bochenek, A. Olszewska‐Mateja, B. and Zaluk, Z. (2000), “Current trends in flip‐chip bonding technique for multichip modules – especially micro‐jet printing”, Proc. XXIV Inter. Conf., IMAPS – Poland Chapter, pp. 47‐61.

2. The corrosive activity of fluxes

3. Golonka, L.G. (1999), “Application of thick films in LTCC technology”, Informacije MIDEM 29, Vol. 4, pp. 169‐75.

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