Bonding of low temperature co-fired ceramics to copper and to ceramic blocks by reactive aluminum/nickel multilayers-Reference-Cited by-同舟云学术

Bonding of low temperature co-fired ceramics to copper and to ceramic blocks by reactive aluminum/nickel multilayers

Published:2011-12-13 Issue:3 Volume:209 Page:512-518
ISSN:1862-6300
Container-title:physica status solidi (a)
language:en
Short-container-title:Phys. Status Solidi A

Author:

Grieseler Rolf,Welker Tilo,Müller Jens,Schaaf Peter

Publisher

Wiley

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. J. Müller J. Pohlner Ceramic Interconnect and Ceramic Microsystems Technology, CICMT 2005

2. J. Müller D. Schwanke T. Haas E. Feurer B. Schweizer A. Klaassen 33rd European Microwave Conference 3 6 2003

3. M. Mach J. Müller European Microelectronics and Packaging Conference (EMPC) 1 7 2009

4. C. A. Walker F. Uribe S. L. Monroe J. J. Stephens R. S. Goeke V. C. Hodges Proc. 3rd Internat. Brazing and Soldering Conference 54 59 2006

5. J. Lenkkeri E. Juntunen M. Lahti S. Bouwstra 1 6 2010

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