Wire bonding characteristics of gold conductors for low temperature co-fired ceramic applications-Reference-Cited by-同舟云学术

Wire bonding characteristics of gold conductors for low temperature co-fired ceramic applications

Published:2004-02 Issue:2 Volume:44 Page:287-294
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Lopez Cristina,Chai Liang,Shaikh Aziz,Stygar Vern

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference5 articles.

1. Fundamentals of microsystems packaging;Tummala,2001

2. Hybrid microcircuit technology handbook;Licari,1998

3. Gold bonding wire alloys: process and application trends;Seuntjens;EuroWire,2000

4. Hybrid microelectronics handbook;Sergeant,1995

5. Investigations of assembly properties of conductive layers in LTCC circuits;Bochenek;Microelectron. Int.,2001

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