Characterization of copper pastes for end termination application of base metal electrode MLCCs

Author:

Akhtar Masyood,Anklekar Rupendra M.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints

2. Hayduk, E.A. Jr and Adam, B.M. (1987), “Nitrogen – nitrous oxide: a reactive atmosphere for copper thick film processing”, The International Society For Hybrid Microelectronics, Vol. 10 No. 4, pp. 14‐19.

3. Rawal, B.S., Childs, M., Cooper, A. and Mclaughlin, B. (n.d.), Reliability of Multilayer Ceramic Capacitor After Thermal Shock, Corporate Research Laboratory, AVX Corporation, 17th Ave. South, PO Box 867, Myrtle Beach, SC 29577, USA.

4. Microstructural Evolution of Copper Thick Films Observed by Environmental Scanning Electron Microscopy

5. Stetson, H.W., Cabato, N.L. and Wahlers, R.L. (1986), “Development of high‐K thick film capacitor with copper electrodes for nitrogen fired system”, IEEE Journal, pp. 488‐92.

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