Submicron Cu@glass core-shell powders for the preparation of conductive thick films on ceramic substrates
Author:
Funder
National Key Research and Development Program of China
Publisher
Elsevier BV
Subject
Mechanics of Materials,General Chemical Engineering
Reference29 articles.
1. Surfactant-stabilized copper paticles for low-temperature sintering: Paste preparation using a milling with small zirconia beads: Effect of pre-treatment with the disperse medium;Liu;Adv. Powder Technol.,2020
2. Properties of power electronic substrates based on thick printed copper technology;Reboun;Microelectron. Eng.,2017
3. Preparation of ultra-fine copper powder and its lead-free conductive thick film;Wu;Mater. Lett.,2007
4. Formulation of a paste for copper thick film;Tang;J. Nanopart. Res.,2021
5. Enhanced heat dissipation of high-power light-emitting diodes by Cu nanoparticle paste;Mou;IEEE Electron Device Lett.,2019
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Printing flexible Cu–Ni traces with high conductivity and high thermal stability by in-situ formed multiscale core–shell structures in inks;Applied Surface Science;2024-02
2. B2O3-ZnO-SiO2 low-melting glass and its application in high reflective white glass ink;Journal of Non-Crystalline Solids;2023-10
3. Constructing Artificial Glass Nanobarrier Layer on Copper Spheres with Robust Antioxidation Properties for Printable Electrode;Chemistry of Materials;2023-07-31
4. Tunable Functionality of Pure Nano Cu- and Cu-based Oxide Flexible Conductive Thin Film with Superior Surface Modification;Surfaces and Interfaces;2023-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3