Wire bonding using insulated wire and new challenges in wire bonding-Reference-Cited by-同舟云学术

Wire bonding using insulated wire and new challenges in wire bonding

Published:2008-04-18 Issue:2 Volume:25 Page:9-14
ISSN:1356-5362
Container-title:Microelectronics International
language:en
Short-container-title:

Author:

Zhong Z.W.

Abstract

PurposeThis paper attempts to review recent advances in wire bonding using insulated wire and new challenges in wire bonding for advanced microelectronics packaging.Design/methodology/approachDozens of journal articles, conference articles and patents published or issued in 2004‐2007 are reviewed.FindingsThe advantages and problems/challenges related to wire bonding using insulated wire are briefly analysed, and several solutions to the problems and recent findings/developments related to wire bonding using insulated wire are discussed.Research limitations/implicationsBecause of page limitation of the paper, only brief review is conducted. Further reading is needed for more details.Originality/valueThis paper attempts to provide introduction to recent developments and the trends in wire bonding using insulated wire. With the references provided, readers may explore more deeply by reading the original articles and patent documents.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference61 articles.

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