Challenges in advanced metallization schemes-Reference-Cited by-同舟云学术

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Challenges in advanced metallization schemes

Published:2006-11 Issue:11-12 Volume:83 Page:2036-2041
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Brillouët M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. G. De Micheli, in: 2004 Design Automation Conference (DAC) 2004, p.77.

2. E. Beigné, F. Clermidy, P. Vivet, A. Clouard, M. Renaudin, in: 11th IEEE International Symposium on Asynchronous Circuits and Systems (ASYNC) 2005, p. 54–63.

3. Statistical mechanics of complex networks

4. Internet – Structure et Evolution;Pastor-Satorras,2004

5. http://www.xinitiative.org/.

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1. Performance of WCN diffusion barrier for Cu multilevel interconnects;Japanese Journal of Applied Physics;2018-02-19

2. Multilevel Metallization;Introduction to Microfabrication;2010-11-09

3. Patterned Films in Micro-devices;Constrained Deformation of Materials;2010

4. Wire bonding using copper wire;Microelectronics International;2009-01-23

5. A wet chemistry approach to sub-micron removable flip chip interconnects;SPIE Proceedings;2008-08-28

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