Author:
Zhou Xiuwen,Qi Yidong,Liu Xudong,Niu Gao,Yang Bo,Yang Yi,Zhu Ye,Yu Bin,Wu Weidong
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science
Reference32 articles.
1. Zhong ZW. Wire Bonding Using Insulated Wire and New Challenges in Wire Bonding[J]. Microelectron. Int., 2008, 25(2): 9–14
2. Ampleford DJ, Jones B, Jennings CA, et al. Contrasting Physics in Wire Array Z-pinch Sources of 1-20 keV Emission on the Z Facility[J]. Phys. Plasmas, 2014, 21(5): 056708–1-056708-10
3. Sinars DB, McBride RD, Pikuz SA, et al. Investigation of High-Temperature Bright Plasma X-ray Sources Produced in 5-MA X-Pinch Experiments[J]. Phys. Rev. Lett., 2012, 109(15): 155 002-1-155 002-5
4. Ampleford DJ, Hansen SB, Jennings CA, et al. Opacity and Gradients in Aluminum Wire Array Z-pinch Implosions on the Z Pulsed Power Facility[J]. Phys. Plasmas, 2014, 21(3): 031201-1- 031201-8
5. Gao XQ, Hu WC, Gao YS. Preparation of Ultrafine Tungsten Wire via Electrochemical Method in an Ionic Liquid[J]. Fusion Eng. and Des., 2013, 88: 23–27
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