No‐clean and Solvent‐clean Mass Reflow Processes of 0.4 mm Pitch, 256‐Pin Fine Pitch Quad Flat Packs (QFPs)-Reference-Cited by-同舟云学术

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No‐clean and Solvent‐clean Mass Reflow Processes of 0.4 mm Pitch, 256‐Pin Fine Pitch Quad Flat Packs (QFPs)

Published:1992-04 Issue:1 Volume:19 Page:19-26
ISSN:0305-6120
Container-title:Circuit World
language:en
Short-container-title:Circuit World

Author:

Lau J.,Govila R.,Larner C.,Pao Y.‐H.,Erasmus S.,Dolot S.,Jalilian M.,Lancaster M.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Reference21 articles.

1. Analytical and Experimental Studies of 208‐pin Fine Pitch (0·5 mm) Quad Flat Pack Solder‐joint Reliability

2. Overview of Tape Automated Bonding Technology

3. An Introduction to Tape Automated Bonding Technology

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrochemical migration tests of solder alloys in pure water;Corrosion Science;1997-08

2. A Brief Introduction to Fine Pitch Surface Mount Technology;Handbook of Fine Pitch Surface Mount Technology;1994

3. Total Quality Management (TQM) and Statistical Process Control (SPC) for Fine Pitch Assembly;Handbook of Fine Pitch Surface Mount Technology;1994

4. Reliability of 0.4 mm Pitch, 256‐pin Plastic Quad Flat Pack No‐clean and Water‐clean Solder Joints;Soldering & Surface Mount Technology;1994-01

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