Author:
Lau J.,Pao Y.‐H.,Larner C.,Govila R.,Twerefour S.,Gilbert D.,Erasmus S.,Dolot S.
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
Cited by
5 articles.
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3. Degradation of Contacts and Package Interconnections;Reliability and Failure of Electronic Materials and Devices;1998
4. Solder Reliability Solutions: A PC‐based Design‐for‐reliability Tool*;Soldering & Surface Mount Technology;1997-12
5. A Brief Introduction to Fine Pitch Surface Mount Technology;Handbook of Fine Pitch Surface Mount Technology;1994